國慶前夕，甘井進行萊爾德產品培訓
發布時間：2023-02-10 16:02:41
十月，云淡氣爽，我們迎來了中華人民共和國七十二歲華誕。國慶前夕，甘井公司也迎來了杜邦聯合萊爾德高性能材料公司帶來的深度產品培訓和應用案例交流會，可謂雙喜臨門。
9月29日下午，杜邦聯合萊爾德資深技術專家對甘井公司相關人員進行了萊爾德導熱界面材料（TIM）的技術培訓及其在5G技術、數據通訊和汽車電子等領域的案例分享與技術前瞻。本次培訓，是杜邦完成對萊爾德高性能材料公司收購之后首次對重要經銷商進行的萊爾德產品培訓和技術交流。
萊爾德導熱界面材料（TIM）具有高性價比、高性能等特點，其設計制造的導熱產品包括導熱墊、相變材料、導熱硅脂和導熱絕緣材料，旨在提供最廣泛的產品系列以滿足各種設計挑戰。尤其在5G應用方面，萊爾德在通訊領域深耕多年，其開發的產品不但具備高導熱系數（7.5W/mK），而且還兼具超軟和低揮發、低滲油等功能。
隨著萊爾德的加入，極大地強化杜邦作為主要電子原始設備制造商和其它制造商重要合作伙伴的實力。杜邦將自身在特種薄膜、軟板材料、干膜和電鍍化學領域的先進知識及技術組合與萊爾德高性能材料的熱管理和電磁屏蔽解決方案結合在一起，通過領先的創新科技和產品組合，解決電子行業大趨勢面臨的關鍵挑戰。合并后的事業體將成為5G、人工智能、智能/電動汽車、物聯網和高性能計算等快速增長市場的先進電子應用的領導者，共同推動未來的行業發展。
通過本次培訓，甘井參訓人員對萊爾德高性能材料有了更深入的了解，對其市場前景及應用充滿期待。甘井公司將繼續依托杜邦公司對材料科學的深入研究、對技術領先的投入和承諾、以及廣泛的工藝技能和悠久的創新歷史，把業界頂尖企業更具前瞻性、更高性能的電子材料系列產品、服務帶給客戶，與客戶共享行業前沿產品及技術，共同成長、實現共贏，為我國國民經濟和社會的發展貢獻自己的一份力量！
最后，祝我們偉大的祖國更加繁榮昌盛！
In October, the clouds were light and cool, and we welcomed the 72nd birthday of the People's Republic of China. On the eve of the National Day, Honey Spring also welcomed the in-depth product training and application case exchange meeting brought by DuPont and Laird Performance Materials, which is a double happiness.
In the afternoon of September 29, DuPont and Laird senior technical experts conducted technical training on Laird Thermal Interface Materials (TIM) and its case sharing and technology foresight in 5G technology, data communication and automotive electronics to relevant personnel of Honey Spring. This training was the first Laird product training and technical exchange for key distributors after DuPont completed the acquisition of Laird Performance Materials.
Laird Thermally Conductive Interface Materials (TIM) are cost-effective and high-performance. They are designed and manufactured to provide the broadest product portfolio to meet various design challenges, including thermally conductive mats, phase change materials, thermally conductive silicone greases and thermally conductive insulating materials. Especially for 5G applications, Laird has been working in the communication field for many years and has developed products with not only high thermal conductivity (7.5W/mK), but also super soft and low volatility and low oil penetration.
With the addition of Laird, it significantly strengthens DuPont's position as a key partner for major electronics OEMs and other manufacturers. DuPont combines its own advanced knowledge and technology portfolio in specialty films, flexible board materials, dry films and plating chemistry with Laird's thermal management and electromagnetic shielding solutions for high performance materials to address key challenges facing the electronics industry's megatrends through a leading-edge portfolio of innovative technologies and products. The combined business unit will be a leader in advanced electronics applications in fast-growing markets such as 5G, artificial intelligence, smart/electric vehicles, IoT and high performance computing, together driving the future of the industry.
Through this training, Honey Spring participants gained a deeper understanding of Laird's high-performance materials and are looking forward to their market prospects and applications. Honey Spring will continue to rely on DuPont's in-depth research in materials science, commitment to technology leadership, extensive process skills and long history of innovation to bring more forward-looking, high-performance electronic materials products and services from top companies in the industry to customers, share the industry's cutting-edge products and technologies with customers, grow together, achieve win-win, and contribute to the development of China's national economy and society! We will share the cutting-edge products and technologies with our customers, grow together, achieve win-win situation, and contribute to the development of our national economy and society!
Finally, I wish our great motherland more prosperity!
